The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

Digitally prototyping complex designs, such as large physical structures, biological features, and micro-electromechanical systems (MEMS) requires supercomputers running sophisticated multiphysics ...

Multiphysics flows describe fluid motions that are strongly coupled to other physical processes such as heat transfer, species transport, phase change, electromagnetism or structural deformation. In ...

Ansys® RedHawk-SC™ is certified for TSMC's advanced 3nm process technology Ansys' comprehensive power, thermal, and reliability analysis enables mutual customers to meet key requirements for ...

Soon after computers entered the technology landscape, finiteelement analysis (FEA) emerged as a method to solve real-world engineering problems. The work of engineers, applied mathematicians, and ...

Every quantum computer is unique – both in the way it’s designed and in how it behaves once implemented. First, designers must choose an approach to implementing qubits. Two of the most popular ...