GRENOBLE, France--(BUSINESS WIRE)--CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such ...
Bubble rafts have long been used to model the bonding and packing of atoms. This tool has also been useful in investigating the behavior of dislocations. Since the bonding of the bubbles is analogous ...
A metallic bond between two beryllium atoms has been forged for the first time in the lab. The development could pave the way for the creation of new materials. “Going back 100 years, chemists have ...
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