The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...
A new technical paper titled “Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication” was published by researchers at Korea University and Georgia Institute of Technology. “As ...
From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
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